The leaker @OnLeaks has published the first CAD-based renderings of the new vivo X70 Pro, successor of the vivo x60 Pro which has been available on our market for a few months.
From the renderings we can see how vivo did not want to overturn the design of the device, which simply improves that of the previous generation. From the images we can see the presence of a display with a central hole at the top. According to rumors, it is a AMOLED panel 6.56 inches with Full HD + resolution (1080 x 2376 pixels), with a refresh rate of 120Hz.
In the back, however, we find a very elegant backcover, interrupted exclusively by a rectangular bump that contains four photographic sensors with ZEISS optics and triple LED flash. Present at the bottom a USB Type-C port, the speaker grille, the microphone and the SIM card slot. Overall measurements are 160.4 x 75.5 x 7.7 ~ 10mm.
Furthermore, thanks to an initial benchmark that emerged from the platform Geekbench, we discover that the model in question has code V2105 and will be powered by the MediaTek Dimensity 1200 octa-core with 12 GB of RAM and Android 11 with Funtouch OS 11.1 interface. The scores obtained are 873 points in single-core and 2985 points in multi-core.
From what has emerged so far, both the X70 and X70 Pro will be powered by the Dimensity 1200 SoC, while the high-end X70 Pro + is expected to be powered by the latest Snapdragon 888+ mobile platform. Additionally, there should be a 50MP Sony IMX766 main sensor and 44W fast charging, which will hit 66W with the X70 Pro + model.
The vivo X70 series is expected to be announced as early as next September.