Qualcomm is preparing to replace the SnapDragon 888, with the Snapdragon 888+.
About a week ago we found ourselves talking about the next flagship chipset by Qualcomm: lo Snapdragon 888+, the features were leaked from Geekbench. Today the rumors are more concrete, thanks to the well-known leaker Evan Blass who shared a preliminary technical data sheet of the SoC on his Twitter.
“SM8450 is Qualcomm’s next-gen premium system-on-chip (SoC). It has an integrated Snapdragon X65 5G Modem-RF system. It is fabricated on a 4nm process.” pic.twitter.com/u1GXMhOWBf
– Evan Blass (@evleaks) June 3, 2021
The processor codenamed SM8450 or Waipio, will be manufactured in a 4nm process and features the latest Qualcomm X65 5G modem that offers download speeds of up to 10Gbps compared to the 7.5Gbps of the X60 5G modem currently found in Snapdragon 888.
In addition, the next generation SoC will debut with the brand new ARMv9 chip architecture with Kryo 780 core. As for the GPU front it appears to have been upgraded from the Adreno 660 to the Adreno 730 (not yet announced), but we have no further details. The camera interface will be based on the brand new Spectra 680 ISP, which is also yet to be introduced.
The Qualcomm FastConnect 6900 chip will handle Bluetooth 5.2 and Wi-Fi 6E connectivity. The source also describes the new Adreno 665 video processing unit and Adreno 1195 display processing unit.
Great expectations therefore for the new Snapdragon 888+, but Qualcomm is not the only one that is pushing hard. Samsung is also ready to make a bang with the upcoming Exynos processor.